Specifications:
Gross weight | 70g |
Brands | Best |
Size | 0.25mm |
Name | Tin Lead Solder Balls for BGA IC Reballing |
Product content:
1. Tin Lead Solder Balls for BGA IC Reballing
Specification:
1. Diameter: 0.25mm
2. Quantity: 25000 per bottle (only 1 bottle included in this item)
3. Material: Tin and Lead
4. Net weight: about 50.00g
Product features:
This item is used for BGA IC reballing and specific tools like BGA reballing stencil are required in this process,
please make sure you know how to use it before you buy this product.
Package content
1 x Bottle Tin Lead Solder Balls for BGA IC Reballing (0.25mm,25K)
Tips:
1. The Product prevails in kind, pictures are just for reference.
2. Please read related information carefully before ordering to avoid mistakes.
3. The item will be shipped in 2 working days after ordering.
4. Specific tools and professional techniques are highly recommended for installation. We are
not responsible for any damage due to improper installation.