New Arrivals
Specifications:
| Gross weight | 450g |
| Brands | SUNSHINE |
SUNSHINE SS-T12A-M6 SS Motherboard Layered Heating System for iPhone X-11 Pro Max
1. Silicone anti-slip pads and cooling holes: hollow grids and non-slip silicone pads are used on the bottom to effectively insulate the temperature, anti-slip and efficient heat dissipation.
2. High hardness thick synthetic stone: The main body is made of special synthetic stone material, high temperature resistance, strong and durable.
3. High Purity Copper Film - Ensures even and stable heat transfer and heating and accurate card positioning.
4. Remove the glue from the CPU and other components: support a variety of chips / universal hard disk / fingerprint cable / CPU degumming and tin removal, accurate card position, non-destructive repair.
SUNSHINE
