New Arrivals
Specifications:
| Gross weight | 200g |
| Brands | RELIFE |
RELIFE TF1 Mini Tetris-Type Heat-Insulating Glass Chip Repair Fixture
Features
1.TF1 heat-insulating glass chip fixture commonly used in various mobile phone chip ICs, small and portable,
chip clamping.
2. Precise and firm clamping, Compatible with most motherboards, High-temperature resistance of 500℃+.
3. Cleverly integrates the charm of Tetris into the fixtures, combining creativity and nostalgia, a new repair
experience.
4. High-temperature resistant tempered glass panel, high-temperature resistant 500℃+, long-term use
without deformation, no fear of high-temperature.
5. Easy to clean and keep clean, glass panel, not easy to corrode, clean with one wipe.
6. Inward bevel design, precise and firm clamping, motherboard suspended in the air to effectively prevent
heat loss caused by motherboard heat conduction, quick desoldering to protect the motherboard.
7. Two-way movement, strong compatibility, suitable for motherboard repair, chip degumming, etc.,
supports more chips, CPUs, hard disks, and other IC clamping.
8. Knob clamping, the slider moves smoothly without getting stuck, and the clamping is precise and firm.
9. Universal chip slot structure, clamp the motherboard firmly, quickly position, and meet various chip
requirements.
RELIFE
