New Arrivals
Specifications:
| Gross weight | 15g |
| Brands | i2C |
i2C FA03 Face Integrated Chip Dot Matrix IC for iPhone 13-14 Pro Max
Features
1. Integrated pad with 183°C melting point pad, direct welding, save time and labor.
2. No welding gasket, no complicated operation, can be welded in 10 seconds.
3. Fixes problems that can't be typed, Face ID is not available, sensing problems, etc.
4. A1 pin identification, easy to identify the chip 1 pin.
5. Imported 16-pin special MCU, high stability.
6. Supports read and write checks on devices v8i, i6S.
7. Support 13/14 full series of models, strong versatility.
Operating Tutorial
1. Before you perform this operation, back up data in the cloud.
2. Take out the cable from the lattice module.
3. Heating and taking out the original dot matrix chip, welding 13/14 series integrated face chip.
4. After the welding is completed, the cable is buckled on the equipment for testing and burning data
that has been backed up.
i2C
