New Arrivals
Specifications:
Gross weight | 1100g |
Brands | Mechanic |
Mechanic IT3 Pro Motherboard Layered/IC Chip BGA Stencil/Dot Matrix Repair Intelligent Preheating Platform for iPhone X-13 Pro Max
Features
1. Suitable for iPhone X/XS/XS MAX/11/11PRO/11 PRO MAX/12/12PRO/12 PRO MAX/
12 MINI/13/13 mini/13 Pro/13 Pro Max.
2. Used for iPhone motherboard layered and fitting, tin planting, BGA desoldering,
IC glue removal, dot matrix Face ID repair, rear camera repair.
3. Intelligent adjustable temperature, modular design
4. No air gun and no soldering iron, just plug and use
5. Multiple combination modules, good scalability, easy to expand new modules.
6. Host size: 12*14cm
7. Voltage 110V/220V
