Loading...
Tell US What You Need?

2UUL BH15 MagGrid Pad Chip Silicone Buffer Soldering Pad

CODE: AS169714

Ships in 24 hours Any questions? Email us
New Arrivals
WL HT007 Logic Board Layered Module without Steel Mesh for iPhone 17/17Air/17Pro/17Pro Max
WL HT007 Logic Board Layered Module for iPhone 16/16Plus/16Pro/16Pro Max
YCS Universal Mobile Phone CPU BGA Stencil Planting U-Platform
JTX JT-6 98.85*98.85mm BGA Soldering Test Practice Board

Specifications:

Gross weight80g
Brands2UUL

Shipping Notice FYI: Holiday Schedule（International Labour Day）-- Fri.:1st,May.-- Tue.:5th,May.
Not Available Online?