Loading...
Tell US What You Need?

WL HT007 Logic Board Layered Module without Steel Mesh for iPhone 17/17Air/17Pro/17Pro Max

CODE: AS177555

Ships in 24 hours Any questions? Email us
New Arrivals
2UUL BH15 MagGrid Pad Chip Silicone Buffer Soldering Pad
WL HT007 Logic Board Layered Module for iPhone 14/14Plus/14Pro/14Pro Max
WL HT007 Logic Board Layered Module for iPhone 15/15Plus/15Pro/15Pro Max
WL HT007 Logic Board Layered Module for iPhone 16/16Plus/16Pro/16Pro Max

Specifications:

Gross weight500g
BrandsWL

Note: Since the iPhone 17 series motherboards lack positioning holes, do not support solder tin planting,
 this series does Not include solder reballing stencil!
Shipping Notice FYI: Holiday Schedule（The Spring Festival）-- Sat:07th,Feb -- Mon.:23th,Feb
Not Available Online?