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WL HT007 Logic Board Layered Module without Steel Mesh for iPhone 17/17Air/17Pro/17Pro Max

CODE: AS177555

Ships in 24 hours Any questions? Email us
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Specifications:

Gross weight500g
BrandsWL

Note: Since the iPhone 17 series motherboards lack positioning holes, do not support solder tin planting,
 this series does Not include solder reballing stencil!
Shipping Notice FYI: Holiday Schedule（The New Year）-- Thur.:1st,Jan -- Sat.:3rd,Jan
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